The first half of $11.6M Microelectronics Commons funding for 5G/6G and Electronic Warfare chip technology to be received by January 2025.
CHIPS Incentives Award with HP to Support Domestic Manufacturing
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Heraeus Announces Merger
Heraeus is combining the high-performance materials expertise of Heraeus Conamic and Heraeus Comvance into a new operating company: Heraeus Covantics.
Archer Improves Quantum Carbon Film Material
Archer has improved the electron spin lifetime and sample-to-sample repeatability and uniformity for its manufacturable quantum carbon film.
Cracking the Chip Code to Meet AI’s Growing Demands
For those wishing to push ahead, a heterogeneous system on chip (SoC) is stacked with possibilities.
Managing the Impact of Semiconductor Manufacturers’ Use of Freshwater
Semiconductor companies must set clear goals for reducing freshwater consumption by enhancing efficiency and promoting circularity within their operations.
Navigating the Complexities of Semiconductor Supply Chains Amidst M&A Surge
As M&A reshapes the semiconductor industry, supply chains need to adapt. AI offers solutions that streamline operations, manage part duplications, and improve visibility.
2025: MEMS Leaps Forward
In 2025 and beyond, we can expect to see existing MEMS devices reimagined in new thin-film piezoelectric materials such as scandium aluminum nitride (ScAlN) and lead zirconate titanate (PZT), which will dramatically improve functionality, precision, and durability.
Imec Announces Breakthrough in Electrically Pumped Nano-Ridge Lasers on Silicon
Imec has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300mm silicon wafers in its CMOS pilot prototyping line.
Sivers Semiconductors Wins a Major Chip Development Program with Leading Tier-1 Telecom Infrastructure Vendor
The $5.4M program will support the development of a next-generation highly-integrated beamforming transceiver for a variety of mmWave telecom applications
