A few days after IBM and Micron publicized their hybrid memory cube, IBM gave their TSV paper at IEDM on the Monday afternoon (paper 7.1). Entitled "3D Copper TSV Integration, Testing and Reliability," they described a node-agnostic through-silicon via (TSV)…
IEDM 2011 Preview
Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2011 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the world’s pre-eminent forum for reporting technological…
IEDM 2011 Preview
Next week the researchers and practitioners of the electron device world will be gathering in Washington D.C. for the 2011 IEEE International Electron Devices Meeting. To quote the conference web front page, “IEDM is the world’s pre-eminent forum for reporting technological…
Intel clarifies 32nm NMOS stress mechanism at IEDM 2011
I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to…
Intel clarifies 32nm NMOS stress mechanism at IEDM 2011
I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to…
Intel clarifies 32nm NMOS stress mechanism at IEDM 2011
I was browsing through the advance program for the upcoming IEDM conference when, almost at the end, I came across paper number 34.4, "Modeling of NMOS Performance Gains from Edge Dislocation Stress," by Weber et al. of Intel. According to…
Organic Processors Offer Microwatt Applications
Printing low power-low performance microprocessors onto organic materials will open a wide range of cost effective alternatives to silicon-based embedded devices, but resolution remains a problem.
GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU
After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first…
GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU
After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first…
GLOBALFOUNDRIES Takes a Different Approach to HKMG in AMD’s Llano CPU/GPU
After much anticipation, and with quite a few design wins, AMD’s Llano CPU/GPU chip arrived on the scene a couple of months ago. Fabricated by GlobalFoundries (more easily known as GloFo) in their 32nm SHP process, it was the first…
