SEMI 3D & Systems Summit to Highlight Heterogeneous Systems for Intelligent Decision-Making and Real-Time Applications

Shannon Davis

7 months ago

The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration.

The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration. Themed Heterogeneous Systems for the Intelligently Connected Era, the summit will unravel the intricate web of collaboration among components driving the next wave of innovation. From artificial intelligence algorithms to sensor data processing, attendees will deep dive into the dynamic framework enabling decision-making and real-time applications in an increasingly connected world. Registration is open.

“SEMI Europe looks forward to welcoming leading experts in Dresden. With exceptional speakers and a brand-new exhibition, the Summit offers insights into cutting-edge heterogeneous integration innovations essential for semiconductor applications, driving the advancement of intelligent systems,” said Laith Altimime, President of SEMI Europe.This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:

AI as a Driver to Grow 3D Technology Implementation
Accelerating the AI Economy through Heterogeneous Integration
Heterogeneous Integration for Photonics Applications
Technology and Market Updates for 2.5D & 3D Packaging for Heterogeneous Integration
Design and Technologies of Chiplet System Architectures
Hybrid Bonding Technologies for Advanced 3D Integration
Manufacturing Innovation for 3D Integration

Featured Speakers

Bill Chen, ASE Fellow & Senior Technical Advisor, ASE, Inc.
Carlos Lee, Director General, EPIC
Dirk Hilbert, Mayor, City of Dresden
E. Jan Vardaman, President, TechSearch International, Inc.
Frank Bösenberg, Managing Director, Silicon Saxony
Kurt Herremans, Program Director Automotive Chiplets, imec
Isabel Obieta, Programme Manager for Sustainable Semiconductors, EISMEA
Liron Gantz, Manager of the Electro-Optics Group, NVIDIA
Ming Zhang, VP of R&D, PDF Solutions
Serge Nicoleau, Group VP of Technology, STMicroelectronics
Seung Kang, Senior VP of Semiconductor Strategy, Adeia

Global Leaders to Present

3D & Systems Summit presenters include experts from global leaders:

Adeia
ANSYS, Inc.
ASE, Inc.
CEA-Leti
Comet Yxlon
EPIC
European Commission
EV Group
Fraunhofer IZM
HEIDENHAIN
imec
KLA Corporation
Lam Research
MKS-Atotech
NVIDIA
PDF Solutions
Siemens EDA
Silicon Saxony
SPTS Technologies
STMicroelectronics
SUSS MicroTec
TechSearch International, Inc.
Tokyo Electron Limited
Yole Group

Networking

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise on the second day of the summit.

Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.

Exhibition

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the new exhibition area. Exhibitors include: Adeia, ASE Inc., ASMPT AMICRA, Besi, CEA-Leti, Comet Yxlon, Confovis, European Chips Diversity Alliance, European Chips Skills Academy, EV Group, Fraunhofer IZM-ASSID, HEIDENHAIN, HiCONNECTS, Lam Research, ProSys, Renishaw, SET Corporation, Tokyo Electron Limited and Wooptix.