SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2024, July 9-11 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2024 on Thursday, July 11 at 11:00 a.m. PDT in the Media Hub.
Presented by SEMI Americas and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.
The following Best of West 2024 finalists will showcase their products on the SEMICON West 2024 show floor:
- Advantest: HA1200 die-level handler – Booth 1039
The new HA1200 die-level handler for the Advantest V93000 system-on-chip (SoC) tester offers die test capability with active thermal control to enable at-speed 100% test coverage before the die are assembled into 2.5D/3D packages, thus ensuring minimal loss of die yield at final test. - EV Group: EVG®880 LayerRelease – Booth 1345
The EVG®880 LayerRelease™ system is the first HVM equipment platform incorporating EVG’s innovative LayerRelease™ technology. It enables nanometer-precision release of bonded, deposited or grown layers from silicon carrier substrates using an IR laser coupled with specially formulated inorganic release materials. As a result, it eliminates the need for glass carriers. - Nordson TEST & INSPECTION: SpinSAM Acoustic Microscopic Imaging (AMI) System – Booth 1233
The latest product from Nordson TEST & INSPECTION is an automated inspection tool that delivers high throughput and better sensitivity for accurately locating defects in wafer-based assemblies. SpinSAM provides superior image quality and defect capture. Successful applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.