With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Organized by SEMI Korea, Advanced Packaging Summit 2024 will bring together leaders from companies such as Intel, Samsung, and SK hynix to explore topics including 2.5D packaging, chiplet packaging, co-packaged optics (CPO) and flip-chip ball grid array (FCBGA) substrate technologies. The Summit will feature a panel discussion that will examine how advanced packaging can help meet the performance demands of AI and HPC.
Agenda Topics and Presenters
- The Journey of the Semiconductor Industry and the Innovation of Advanced Packaging – Heejoung Joun, Samsung Electronics
- CPO (Co-Packaged Optics) – David Harame, AIM Photonics
- Advanced Packaging Technology for HBM and 2.5D SiP – Ho-Young Son, SK hynix
- Enabling the AI Era – Jinyoung Jeon, ASMPT
- The Role of Advanced Packaging Technology for AI – SungSoon Park, Intel
- FCBGA Substrate Technologies for AI/HPC – Mooseong Kim, LG Innotek
- Advanced Packages for Chiplets – TaeKyeong Hwang, Amkor Technology Korea
- Glass Substrates – Prof. Bongyoung Yoo, Hanyang University
Advanced Packaging Summit Sponsors
Registration is open until September 4, 2024. More information can be found on the event website.