The global semiconductor manufacturing equipment market size is estimated to grow by USD 46.68 bn from 2024-2028, according to Technavio. The market is estimated to grow at a CAGR of 7.74% during the forecast period.
The semiconductor manufacturing equipment market is characterized by rapid advancements in technology, driven by the increasing demand for powerful, efficient, and compact semiconductor devices. Key players, such as Tokyo Electron Limited and Applied Materials Inc., are responding to this trend with innovative solutions. In March 2023, SCREEN PE Solutions introduced the Ledia 7F-L direct imaging system for large-sized substrates. Applied Materials followed with the VeritySEM 10 eBeam metrology system in April 2023, designed for EUV and high-NA EUV lithography. These developments support various industries, including electric vehicles, data processing sectors, and AI, as well as emerging technologies like 5G network connectivity, smart cities, and smart homes. Semiconductor manufacturing equipment encompasses photolithography tools, etching machines, measurement machines, and more, all essential for producing advanced semiconductors for consumer electronics, home appliances, and 5G-enabled devices.
The semiconductor manufacturing equipment market faces intricate challenges, including the need for dust-free environments and precision data transfer, amplified by the surge in demand for SiC wafers and the limitations of lithography equipment. Key sectors, such as automotive and consumer electronics, drive expansion plans at major semiconductor hubs. EUV lithography equipment, IC architecture, memory, and low-cost devices are focal points. Ultra-thin silicon dioxide, secure memory, encryption hardware, 3D IC manufacturing, and functional integration are advanced technologies shaping the industry. Miniature devices, electronic products, and IC designs are also evolving, with cloud technology, 5G networks, connected vehicles, and Silicon wafers influencing the front-end segment. Interposer technology, wafer fabrication facilities, and hybrid bonding techniques are essential for inter-die communication in portable devices, laptop computers, and IDMs. Chinese chipmakers, chip foundries, and the semiconductor industry’s continuous developments are shaping the global landscape.