JOHN MILLER,Sr. Product Marketing Manager for Circuit Edit, Thermo Fisher Scientific
For semiconductor manufacturers, accelerating product development and time-to-market are critical, as missing a technology window, or falling behind, can cost billions in lost revenues. Increased density, smaller features, complex device designs and advanced packaging are making it more difficult to produce initial designs that will function as intended.
As logic architectures have evolved from planar to FinFETs, each successive generation has introduced unique design and manufacturing challenges. With semiconductors evolving again towards Gate-All-Around (GAA) FETs architectures and three-dimensional (3D) semiconductor packaging, it is anticipated designers will encounter new problems that are difficult to predict based on previous work.
With semiconductor manufacturers moving to new structures and process nodes, the circuit edit function continues to grow in strategic importance for reducing costs, improving performance and functionality, and accelerating time-to market.
In this article, we’ll discuss focused ion beam (FIB) circuit edit and its benefits, circuit edit challenges associated with today and tomorrow’s semiconductor devices and provide insight into the capabilities needed from circuit edit solutions to meet the next generation of semiconductor circuit edit needs.
Click here to read the full article in Semiconductor Digest magazine.
