ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
ALD of Crystalline High-K SHTO on Ge
Alternative channel materials (ACM) such as germanium (Ge) will need to be integrated into future CMOS ICs, and one part of the integration was shown at the recent Materials Research Society (MRS) spring meeting by John Ekerdt, Associate Dean for…
