Areas ideally suited for AI applications may be repetitive and mental labor-intensive tasks with good available data, or when analytical methods are not applicable or too difficult to find, or data interpolation.
AI, Cameras and Your Smartphone: Computing at the Edge and On the Go
An AI-powered camera using a dedicated co-processor chip with innovative deep learning algorithms can deliver a vision-based solution with unmatched performance, power efficiency, cost-effectiveness, and scalability.
Survey: Understanding the Data-Centric Era
The Data-Centric Era is here. It demands highly flexible, high bandwidth and secure infrastructure to meet the demands of highly variable, large and diverse data. Composable infrastructure provides the flexibility, bandwidth and efficiency to meet that demand.
Edge AI Computing Advancements Driving Autonomous Vehicle Potential
Autonomous driving systems are extremely complex; they tightly integrate many technologies, including sensing, localization, perception, decision making, as well as the smooth interactions with cloud platforms for high-definition (HD) map generation and data storage.
New Insight into Two Widely Accepted Forms of Deep Learning
Experts at BrainChip offered new insights and considerations for the use of transfer learning and incremental learning in edge AI/IoT environments.
Singapore’s Five Research Pillars Outlined at SEMICON Southeast Asia
At SEMICON Southeast Asia 2021, Mr. Terence Gan, SVP, Semiconductors, Economic Development Board (EDB) of Singapore, outlined five research pillars.
New Plating Tool for WLP and Plating in Compound Semi Manufacturing
ACM’s Ultra ECP GIII plating tool is designed for WLP for compound semiconductors, with product offerings for SiC, GaN and GaAs. The tool is also capable of plating gold into backside deep hole processes with greater uniformity and better step coverage.
IBM Unveils On-Chip Accelerated Artificial Intelligence Processor
At the annual Hot Chips conference, IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring deep learning inference to enterprise workloads to help address fraud in real-time.
Samsung Brings In-memory Processing Power to Wider Range of Applications
Samsung’s revelations at Hot Chips include the first successful integration of its PIM-enabled High Bandwidth Memory (HBM-PIM) into a commercialized accelerator system, and broadened PIM applications to embrace DRAM modules and mobile memory.
What Trends Will Have the Biggest Impact on Semiconductor Design?
Semiconductor design has progressively improved over the decades, and that will continue for the foreseeable future. Here are some fascinating trends that will likely shape the future of engineering at all stages of product development.
