InGaN/GaN microLEDs are a strong candidate to enable high data-rate light communication because of their robustness, availability at large scale and ability to reach GHz scale bandwidth.
CEA-Leti & Dolphin Design Report FD-SOI Breakthrough
CEA-Leti and Dolphin Design have developed an adaptive back-biasing (ABB) architecture for FD-SOI chips that can be seamlessly integrated in the digital design flow with industrial-grade qualification, overcoming integration drawbacks of existing ABB techniques.
IITC: New Materials for Advanced Interconnects
The 17th annual International Interconnect Technology Conference (IITC) will be held May 21 – 23, 2014 in conjunction with the 31st Advanced Metallization Conference (AMC) at the Doubletree Hotel in San Jose, California.
