Extending interconnects towards the 3nm technology node and beyond requires several innovations. Imec sees single-print EUV in dual-damascene modules, Supervia structures, semi-damascene modules and added functionality in the back-end-of-line (BEOL) as the way forward.
Bottoms-up ELD of Cobalt Plugs
As reported in more detail at Solid State Technology, during the IEEE IITC now happening in Grenoble, imec and Lam showed a new Electroless Deposition (ELD) cobalt (Co) process that is claimed to provide void-free bottoms-up pre-filling of vias and…
