The Fusion® F07 is crafted to withstand common etch and CVD oxygen/fluorine based gases in semiconductor processing subfab lines, at temperatures up to 355°F (180°C).
Nanoscale Features through Atomic Layer Processing
Atomic layer etching and deposition processes offer atomic scale control through the use of self-limiting reactions.
Litho becomes Patterning
Once upon a time, lithographic (litho) processes were all that IC fabs needed to transfer the design-intent into silicon chips. Over the last 10-15 years, however, IC device structural features have continued to shrink below half the wavelength of the…
