The complexity of the semiconductor manufacturing process is well known, but the logistics of supplying a megafab with equipment and materials can be equally complex. Delivering just one EUV lithography tool, for example, takes three Boeing 747 cargo planes, 40 freight containers and 20 trucks.
Semiconductor Materials Market: Better Things to Come in 2024
The total semiconductor materials market is forecasted to rebound with almost 7% growth in 2024 to reach US$74 billion. This upwards turnaround comes after a contraction of -3.3% in 2023 due
Intel 4 Process Drops Cobalt Interconnect, Goes with Tried and Tested Copper with Cobalt Liner/Cap
At the VLSI Symposia in June, Intel presented a paper “Intel 4 CMOS Technology Featuring Advanced FinFET Transistors Optimized for High Density and High-Performance Computing.” Blogger Dick James reports on details of the interconnect strategy.
Overcoming the Semiconductor EUV Fab Dilemma of Stochastics
While the conventional approach thinks of noise as a nuisance that must be thrown away, the Fractilia Inverse Linescan Model approach thinks of noise as information that should be measured and used.
Scaling Progress Takes Many Paths at VLSI Symposium
The IEEE 2022 Symposium on VLSI Technology and Circuits attracted 650 people to attend in person in Honolulu, and an equal number of virtual attendees.
Automating Mask SEM Analysis Using Digital Twins
Deep Learning can learn features from the SEM images generated using digital twins, then use that learning to find defects on real SEM images.
Mitigation of Pattern Collapse in EUVL
Rinse materials offer benefits of pattern collapse mitigation and defect improvement and, therefore, superior process margins for yield improvement. Defectivity is also significantly improved with an EUV rinse.
EUV Lithography: Sailing Along the Stochastic Cliffs
Stochastic printing failures are random, non-repeating, isolated defects such as microbridges, locally broken lines and missing or merging contacts.
EUV Lithography: Weighing the Options for Future Logic and Memory Applications
Imec takes a great leap forward in understanding and pushing the limits of extreme ultraviolet lithography – part I
