Rethinking chip architecture from the ground up is no small feat. Intel Core Ultra is Intel’s biggest SoC design change in 40 years, and Wilson, a 22-year Intel veteran, says it took a unique team with a massive breadth of expertise.
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding
Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.