The LITHOSCALE system will be installed at PMT’s headquarters in Asan-si, Chungcheongnam-Do, South Korea, where it will be used in the production of next-generation MEMS-based probe cards for wafer-level testing of advanced NAND, DRAM and High Bandwidth Memory (HBM) devices.
Demand for AI-Optimized Chipsets to Spur Requirements for Hybrid Bonding
Compared with other methods, hybrid bonding offers inherent advantages in high-density IO (input- output), reduced parasitic delay, shorter height and improved thermal performance.
