A new wave of growth is sweeping through the semiconductor industry, propelled by a vast array of new applications, including artificial intelligence, virtual and augmented reality, automotive, 5G, the IoT, cloud computing, healthcare and many others.
IBM Shows Graphene as Epi Template
Last month in Nature Communications (doi:10.1038/ncomms5836) IBM researchers Jeehwan Kim, et al. published “Principle of direct van der Waals epitaxy of single-crystalline films on epitaxial graphene.” They show the ability to grow sheets of graphene on the surface of 100mm-diameter…
Can we take cost out of technology scaling?
At The ConFab, IBM’s Gary Patton spoke about the future of scaling and concluded that it we will continue scaling with new technology innovation, but we have to figure out how to drive the cost out.
Three fundamental shifts
At The ConFab, IBM’s Gary Patton gave us three reasons to be very positive about the future of the semiconductor industry: an explosion of applications, the rise of big data and the need to analyze all that data.
IITC: New Materials for Advanced Interconnects
The 17th annual International Interconnect Technology Conference (IITC) will be held May 21 – 23, 2014 in conjunction with the 31st Advanced Metallization Conference (AMC) at the Doubletree Hotel in San Jose, California.
No technical barriers seen for 450mm
Paul Farrar, general manager of the G450C consortium, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint.
