We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At…
Ferromagnetic Room Temperature Switching
Bismuth-ferrite could make spin-valves that use 1/10th the power of STT A research team led by folks at Cornel University (along with University of California, Berkeley; Tsinghua University; and Swiss Federal Institute of Technology in Zurich) have discovered how to…
ASML Books Production EUV Orders
TSMC commits to two tools for delivery next year Maybe, just maybe, ASML Holding N.V. (ASML) has made the near-impossible a reality by creating a cost-effective Extreme Ultra-Violet (EUV @ ~13.5nm wavelength) all-reflective lithographic tool. The company has announced that…
Leti integrates everything
Now I know how wafers feel when moving through a fab. Leti in Grenoble, France does so much technology integration that in 2010 it opened a custom-developed people-mover to integrate cleanrooms (“Salles Blanches” in French) it calls a Liaison Blanc-Blanc…
Chasing IC Yield when Every Atom Counts
Increasing fab costs coming for inspection and metrology At SEMICON West this year in Thursday morning’s Yield Breakfast sponsored by Entegris, top executives from Qualcomm, GlobalFoundries, and Applied Materials discussed the challenges to achieving profitable fab yield for atomic-scale devices…
Moore’s Law is Dead – (Part 4) Why?
We forgot Moore merely meant that IC performance would always improve (Part 4 of 4) IC marketing must convince customers to design ICs into electronic products. In 1965, when Gordon Moore first told the world that IC component counts would…
Moore’s Law is Dead – (Part 3) Where?
…we reach the atomic limits of device scaling. At ~4nm pitch we run out of room “at the bottom,” after patterning costs explode at 45nm pitch. Lead bongo player of physics Richard Feynman famously said, “There’s plenty of room at…
Moore’s Law is Dead – (Part 2) When?
…economics of lithography slow scaling. Moore’s Law had been on life support ever since the industry started needing Double-Patterning (DP) at 1/4-pitch of 193nm optical lithography. EUV lithography shows slow and steady progress in source and resist technologies, and ASML…
Moore’s Law is Dead – (Part 1) What?
…twice the number of components won’t appear on the next IC chip (Part 1 of 4) Gordon Moore always calls it “so-called Moore’s Law” when discussing his eponymous observation about IC scaling trends, and he has always acknowledged that it’s…
