The agenda is set for The ConFab, to be held May 14-17, 2017 in San Diego at the iconic Hotel del Coronado.
Moore’s Law Smells Funny
…maybe we need “Integrated Cleverness Law” “Jazz is not dead, it just smells funny.” – Frank Zappa 1973 from Be-Bop Tango (Of The Old Jazzmen’s Church) Marketing is about managing expectations. IC marketing must position next-generation chips as adding significant…
The New Driver for Semiconductor Tech
The explosion of data created by the IoT will challenge the infrastructure of the entire network.
China to be 15% of World Fab Capacity by 2018
Currently there are eight Chinese 300mm-diameter silicon IC fabs in operation as 2016 comes to a close. Chinese IC fab capacity now accounts for approximately 7% of worldwide 300mm capacity, as reported by VLSIresearch in a recent edition of its…
Andy Grove blessed us all
Andy Grove, the man who codified the commercial IC industry dynamic as “Only the Paranoid Survive” died yesterday at the age of 79. His instinctive paranoia derived from his tragic experiences while growing up in Hungary, as referenced by Wikipedia…
3D XPoint uses PCM Material in ReRAM Device
IM Flash pre-announced “3D XPoint”(TM) memory for release later this year, and lack of details has led to widespread confusion regarding what it is. EETimes has reported that, “Chalcogenide material and an Ovonyx switch are magic parts of this technology…
Cross-point ReRAM Integration Claimed by Intel/Micron
The Intel/Micron joint-venture now claims to have successfully integrated a Resistive-RAM (ReRAM) made with an unannounced material in a cross-point architecture, switching using an undisclosed mechanism. Pilot production wafers are supposed to be moving through the Lehi fab, and samples…
No technical barriers seen for 450mm
Paul Farrar, general manager of the G450C consortium, said early work has demonstrated good results and that he sees no real barriers to implementing 450mm wafers from a technical standpoint.
