Areas ideally suited for AI applications may be repetitive and mental labor-intensive tasks with good available data, or when analytical methods are not applicable or too difficult to find, or data interpolation.
Mid-Infrared Optical Metrology for High Aspect Ratio Holes in 3D NAND Manufacturing
Infrared critical dimension metrology (IRCD) addresses the shortcomings of conventional ultraviolet to near-infrared OCD in channel hole etch high-fidelity z-profile and amorphous carbon hardmask etch BCD metrology.
Metrology Solutions for Gate-All-Around Transistors in High Volume Manufacturing
High-speed, non-destructive OCD metrology has the capability needed to support process control throughout the GAA process flow.
