Extreme Ultra-Violet Lithography (EUVL) keeps hurting my brain. Just when I can understand how it could be used in profitable commercial high-volume manufacturing (HVM) I hear something that seriously strains my brain. First it was the mirrors and mask in…
Cross-point ReRAM Integration Claimed by Intel/Micron
The Intel/Micron joint-venture now claims to have successfully integrated a Resistive-RAM (ReRAM) made with an unannounced material in a cross-point architecture, switching using an undisclosed mechanism. Pilot production wafers are supposed to be moving through the Lehi fab, and samples…
