What are the business vs technical challenges of semi IP for price-sensitive, low-volume but still critical designs? CAST IP CEO Nikos Zervas answers these questions and more in this interview with John Blyler at DVCon Mar 2016. Originally published on…
Cross-point ReRAM Integration Claimed by Intel/Micron
The Intel/Micron joint-venture now claims to have successfully integrated a Resistive-RAM (ReRAM) made with an unannounced material in a cross-point architecture, switching using an undisclosed mechanism. Pilot production wafers are supposed to be moving through the Lehi fab, and samples…
CMP Slurry Trade-offs in R&D
As covered at SemiMD.com, the CMP Users Group (of the Northern California Chapter of The American Vacuum Society) recently held a meeting in Albany, New York in collaboration with CNSE, SUNY Polytechnic Institute, and SEMATECH. Among the presentations were deep…
