Sacrina brings application specific advanced packaging services to IFS customers.
Sondrel Completes a Multi-Billion Transistor Chip Design at 5nm
UK-based Sondrel completed its most complex chip design to date. Designed on a 5nm process node, this ultra-complex design has more than 50 billion transistors.
The ‘Blank Sheet’ that Delivered Intel’s SoC Design Change
Rethinking chip architecture from the ground up is no small feat. Intel Core Ultra is Intel’s biggest SoC design change in 40 years, and Wilson, a 22-year Intel veteran, says it took a unique team with a massive breadth of expertise.
What’s New in the 2022 IEEE IP-XACT Standard? Big Reveals from the Chair
Does semiconductor IP still matter? And what does the chair of the IEEE-1685 IP-XACT standard reveal about the latest feature sets?
What the CHIPS and Science Act Could Mean for Domestic Semiconductor Manufacturing Innovation
It’s important for semiconductor companies to utilize the CHIPS Act funding as effectively as possible. One way to do this is by switching to a chiplet-based design flow.
How Can a Digital Twin Help Semiconductor Systems Design?
A digital twin is a virtual, extremely detailed version of a physical asset. People create them as single components and all the way up to entire factories. Doing so can let them see the impact of certain decisions before moving ahead with them in real life.
Batteries? We don’t need no stinking batteries.
We’re still used to thinking that low-power chips for “mobile” or “Internet-of-Things (IoT)” applications will be battery powered…but the near ubiquity of lithium-ion cells powering batteries could be threatened by capacitors and energy-harvesting circuits connected to photovoltaic/thermoelectric/piezoelectric micro-power sources. At…
