Teradyne, a supplier of automated test solutions, today launched Teradyne Archimedes analytics solution, an open architecture that brings real-time analytics to semiconductor test, optimizing test flow and yield, and lowering costs—while reducing the security risks present with cloud-based solutions.
“Demand for higher-quality semiconductor devices that use advanced processes is increasing the complexity of semiconductor manufacturing—and only comprehensive test and analytics solutions can help address this,” said Regan Mills, vice president of marketing and general manager, Semiconductor Test Division, Teradyne. “Offering an open architecture that lets our customers choose the most effective data analytics solutions for their environment, Teradyne Archimedes helps identify failures and their root causes, allowing corrective actions to be taken, both before and during high-volume manufacturing.”
As part of a greater technology ecosystem, Teradyne Archimedes integrates seamlessly with leading data analytics platforms, speeding time to analysis.
“Exensio Advanced Insights for Manufacturing is a secure, scalable, configurable, analytics and AI platform specifically designed to handle rapid decision-making in a high-volume production environment, including the edge deployment of Exensio AI inference engine,” said Said Akar, general manager, Exensio, PDF Solutions. “Teradyne Archimedes analytics solution extends the benefits of our system’s data and machine learning capabilities to Teradyne’s global customer base in automated semiconductor test.”
“The challenge of maintaining security and data integrity has never been more critical,” said Uzi Baruch, chief strategy officer, proteanTecs. “The combination of Teradyne Archimedes analytics solution with proteanTecs deep data analytics enables telemetry-based insights that add immeasurable value to semiconductor test. The integration of our ML-driven cloud and edge software into Teradyne’s open analytics development environment delivers a new level of device visibility to meet the surging performance, power and reliability requirements of advanced systems.”
