The countdown to The ConFab has officially begun. The dates are set: next year’s event will be held June 23-26, 2013 and we’ll be back at the Encore at The Wynn Las Vegas (an encore at The Encore!). Thanks to everyone who participated last year. We had two great keynotes – John Chen from Nvidia and Ali Sebt from Renesas – plus six other sessions, packed with great speakers. We also had our first “executive roundtable” discussion. See our recently posted "The ConFab 2012: A retrospective" for an overview of our coverage.
We’re already gearing up for next year’s event, and would like to welcome to our newest member of the advisory board, Liam Madden of Xilinx, Inc. Liam is corporate vice president of FPGA Development and Silicon Technology at Xilinx. He has responsibility for FPGA design, Advanced Packaging (including Stacked Silicon Interconnect) and Foundry Technology.
Xilinx has been well represented at The ConFab in recent years, with Ivo Bolsens, CTO, speaking in 2011, and, in 2012, Xin Wu, Senior Director, Silicon Technology, and Sandeep Bharathi, Vice President of Engineering.
Liam joins representatives of two of the other major fabless companies already on the advisory board: Geoffrey Yeap, VP of Technology, Qualcomm Inc., and Abraham Yee, Director Advanced Technology & Package Development, Nvidia Corporation.
The ConFab is one of the few events that specifically addresses the growing importance of the fabless-foundry supply chain, and that emphasis will continue in 2013.
If you are a senior executive from the device manufacturing, foundry, packaging or fabless community, then you have the opportunity to attend The ConFab as our complimentary VIP Guest. Simply register on The ConFab website and we’ll review and get back to you shortly.
For sponsorship opportunities, please contact Sabrina Straub: sabrinas@pennwell.com.
We’ll be working on content shortly, so stay tuned!
Pete Singer (peters@pennwell.com).