TopLine Corporation announced today that Martin Hart, CEO of TopLine and inventor, has been awarded US Patent D874,413 S for a fixture designed to deliver 1752 solder columns onto a substrate as part of the Ceramic Column Grid Array (CCGA) assembly process. The patent was awarded on February 4, 2020.
TopLine’s innovative CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (PCBs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder joint reliability under harsh operating conditions. For more information, and a quick chart of TopLine CCGA products, visit http://www.topline.tv/CCGA.html. For more information about CCGA, visit www.CCGA.co.
In addition to CCGA solutions, TopLine also manufactures Daisy Chain test components, Zero Ohm PCB jumpers and engineering evaluation kits for experimentation. TopLine also makes vibration dampers to extend the life of PCB assemblies. For more information, visit www.topline.tv.
