Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, today announced that its XFMEXPRESS technology for removable PCIe attached, NVM memory devices has received a Flash Memory Summit ‘Best of Show’ award. Featuring a powerful combination of small size, speed and serviceability, XFMEXPRESS technology was developed to enhance next-generation mobile and embedded applications.
“Industry innovations in storage include the recent protocol advancements such as NVMe, and now new advancements in form factor and packaging can lead the next wave in consumer SSDs,” said Jay Kramer, chairman of the awards program and president of Network Storage Advisors Inc. “We are proud to recognize Toshiba Memory for leading the next generation of mobile and embedded consumer storage with the new industry form factor for PCIe/NVMe devices called XFMEXPRESS – and leading the market with breakthrough storage solutions.”
Recognizing the need for a new class of removable storage, Toshiba Memory leveraged its extensive background in single-package memory designs to develop XFMEXPRESS technology. A new form factor and innovative connector allow XFMEXPRESS technology to deliver an unparalleled combination of features designed to improve flash storage use in ultra-mobile PCs, IoT devices and various embedded applications.
“With XFMEXPRESS, we are redefining flash storage technology to enable the thinner, smaller, serviceable form factors of the future,” noted Hiroo Ota, technology executive for Toshiba Memory Corporation. “We are honored that the Flash Memory Summit judging panel recognizes our efforts to innovate, solve complex design challenges – and drive the PC and IoT industries forward.”