Chip manufacturing is a journey of a thousand process steps. Each step requires extreme precision and control in order to efficiently and quickly travel from bare silicon to final functional chip. KLA’s new Voyager 1035 laser scanning patterned wafer inspector helps guide chip manufacturing by monitoring critical process steps during ramp and volume production. By finding and flagging critical defects inline, the Voyager 1035 inspector helps to ensure process steps stay on the path to successful chip production.
Voyager 1035 laser scanning patterned wafer inspection system
As an inline defect monitor for advanced logic and memory chip manufacturing, the Voyager 1035 provides an optimal balance of sensitivity, speed and cost of ownership. For critical process monitoring applications, the Voyager 1035 employs a unique architecture, deep learning algorithms and several advanced technologies to produce industry-best laser scanning sensitivity at high throughput. This ensures fab engineers receive the timely, actionable defect data needed to take the corrective actions required to keep chip production on track.
DefectWise deep learning technology makes it quick and easy to separate real defects of interest from nuisance while improving sensitivity to DOI that matter
DefectWise deep learning technology makes it quick and easy to separate real defects of interest from nuisance while improving sensitivity to DOI that matterThe landmark attribute of Voyager 1035 is DefectWise deep learning technology. DefectWise provides fast, inline separation of defects of interest from pattern noise and nuisance defects, resulting in increased sensitivity and improved capture rate of key defects. By producing accurate defect binning results, DefectWise reduces the time required for fab engineers to understand and correct process excursions.
Other key features of the Voyager 1035 that drive sensitivity and productivity include the following:
- Industry-unique oblique illumination and outside-the-lens design reduce inspection noise for improved capture of defects
- Industry-largest total solid angle of collection produces more signal to critical defects while also capturing signal from more defect types
- Three segregated channels enable data collection strategies that result in strong defect signal-to-noise
- New sensors with a 30% improvement in QE (Quantum Efficiency) drive higher throughput and better sensitivity for lower dose inspection on delicate photoresists found in applications such as after develop inspection (ADI) and photo cell monitoring (PCM) for EUV lithography
- A new pixel size option increases resolution by >20% over the previous-generation Voyager for improved sensitivity to very small, yield-relevant defect types
