TECHCET announced 3D NAND memory evolution is driving increased use of WF6, NF3, and heavy noble gases (Kr and Xe), which may lead to a supply shortage. WF6 demand growth, with a CAGR of 14.2%, is expected to outstrip supply by 2024/2025. The high growth is due to increased use of tungsten in 3DNAND and fab expansions. NF3 demand growth, with a CAGR of 15.8%, is also expected to outpace supply by 2025. It is heavily used in chamber clean and etch processes across the semiconductor and FDP industry. NF3’s demand growth is driven by 3DNAND and FDP post Covid recovery.
“Due to vertical scaling of 3DNAND, the demand for tungsten deposition (WF6) and chamber clean gases (NF3) for dielectric PECVD and tungsten ALD continues upwards and may cause a supply shortage in 2024 unless suppliers increase capacity,” said TECHCET’s Sr. Analyst Dr. Jonas Sundqvist. “As of now, no suppliers have specifically announced capacity increase.” Hopefully, in the future, suppliers will announce capacity increases for WF6 and NF3 to combat this shortage.
