The ULP HYPERRAM™ Enrich MCU Eco-system

Available for On Demand viewing

Overview:

The IoT market is growing very fast with overall shipments of IoT related MCUs to reach 23 billion units in 2025. In the past, MCUs were used to provide basic functions with a simple OS system. As consumers want more features, IoT devices have become more popular, requiring more memory and a higher density. Most existing MCUs support SDRAM, but newer MCUs have started to support both HYPERRAM and SDRAM. When it comes to pins for data transmission, performance is not always the biggest issue.

This webinar discusses the typical DRAM device and functions, and highlights Winbond’s HYPERRAM product, which is an ideal solution for IoT and endpoint applications with its power saving features and flexible density choices.

Presented by:

Omar Ma
Winbond America DRAM Marketing Manager

About the Presenter:

Before joining Winbond, Omar worked for a semiconductor company and chip design house as a memory circuits designer in Taiwan. After he became a specialty DRAM marketing manager at Winbond Taiwan for two years. Now he is responsible for both specialty and mobile DRAM products for the North America market. He is located on San Jose, California.