The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
The CES Innovation Awards program is an annual competition honoring outstanding design and engineering in 33 consumer technology product categories. The program received a record number of submissions – over 3,400. The announcement comes ahead of CES 2025, the world’s most powerful technology event, happening Jan. 7-10 in Las Vegas, NV.
The xMEMS XMC-2400 active micro-cooling (µCooling) chip allows manufacturers, for the first time, to integrate active cooling into smartphones, tablets, XR, smart glasses, cameras, SSDs, and other advanced mobile devices with a silent, vibration-free, solid-state chip that measures just 1-millimeter thin.
“We’re honored for our revolutionary XMC-2400 ‘fan-on-a-chip’ to be recognized by the CES Innovation Awards for the legitimate breakthrough that it is,” said Joseph Jiang, xMEMS CEO and Co-Founder. “Up until now, thermal management of thin, small form-factor electronics has been a massive challenge for manufacturers and consumers. XMC-2400 is poised to address those challenges and it comes at a critical moment in the industry – as ultramobile devices are running more processor-intensive AI applications.”
Measuring just 9.26 x 7.6 x 1.08 millimeters and weighing less than 150 milligrams, the XMC-2400 is 96 percent smaller and lighter than non-silicon-based, active-cooling alternatives. A single XMC-2400 chip can move up to 39 cubic centimeters of air per second with 1,000Pa of back pressure. The all-silicon solution offers semiconductor reliability, part-to-part uniformity, high robustness, and is IP58 rated.
xMEMS will be demonstrating the XMC-2400 at CES in The Venetian Suite 29-235 in Las Vegas January 7-10, 2025. Click here to schedule an appointment.
