With semiconductor devices continuing to evolve and shrink, the need for greater reliability has never been more critical. MacDermid Alpha Electronics Solutions, a supplier of integrated materials and chemistry for the electronics industry, unveiled its new product range ‘Low Alpha Tin’ – innovative technology designed to address the growing problem of soft errors caused by alpha emissions in next-generation semiconductors.
As devices become smaller, complex, and functional demands increase, the challenge of minimizing alpha particle emissions becomes even more urgent. These emissions, even in tiny amounts, can disrupt performance and reliability – leading to soft errors in critical applications such as SRAM, DRAM, and AI systems. In response, MacDermid Alpha Electronics Solutions has launched its new Low Alpha Tin portfolio engineered to reduce alpha emissions, lowering the risk of these potentially catastrophic errors.
Soft Errors: A Growing Concern for Shrinking Devices
The trend toward smaller, more powerful semiconductor devices has driven a demand for components that operate with greater performance. But as these devices shrink, their sensitivity to factors such as alpha particles, becomes increasingly problematic. Alpha emissions are a primary cause of soft errors, which can have significant implications for device performance, leading to poor reliability, data corruption, or system failure.
Ashley Kuppersmith, Product Manager – Wafer Level Packaging at MacDermid Alpha, explains, “As advanced packaging architectures like 2.5D and 3D ICs continue to gain prominence, the sensitivity to alpha particle emissions increases. Our Low Alpha Tin solutions are specifically designed to address these challenges, ensuring that reliability and performance remain uncompromised.”
Performance You Can Trust
MacDermid Alpha’s Low Alpha Tin portfolio is crafted from high-purity tin materials to meet the highest standards in the industry. The portfolio includes Sn-MSA and soluble tin anodes that leverage MacDermid Alpha’s vertically integrated supply chain and advanced purification processes to deliver exceptional quality and performance. Key features include:
- Ultra-low alpha particle emissions of less than 0.002 cts/khr-cm2
- Tin purity of >99.99% for unparalleled performance
- Trace metals reduced to less than 10ppm, ensuring minimal contamination
- Solutions compatible with both soluble and insoluble anodes for flexible application
The new product portfolio provides the performance reliability necessary for high-end semiconductor applications, such as memory devices, AI processors, and advanced packaging systems.
Sustainable and Reliable Solutions
MacDermid Alpha is committed to not only meeting performance expectations but also helping customers meet Environmental, Health, and Safety (EH&S) goals. The Low Alpha Tin portfolio supports sustainability by utilizing sustainable sourcing practices and non-conflict metals, allowing semiconductor designers to push the boundaries of innovation while reducing environmental impact.
