TECHCET forecasts a 6% increase in CMP Consumables revenue for 2025, driven by advances in memory and logic chips. The Total Addressable Market (TAM) for CMP Consumables is expected to grow from $3.42B in 2024 to $3.62B in 2025, fueled by high-volume manufacturing of 3D NAND, FinFET Logic, and DRAM devices, which require more CMP steps due to the increasing complexity and challenges associated with manufacturing those devices, according to TECHCET’s Critical Materials Report™ on CMP Consumables.
In 2024, CMP Consumables saw modest growth, with a 1.5% increase in revenue driven by a slight recovery in memory and advanced logic chips. Legacy devices saw weaker demand, particularly in the automotive sector. The largest segments—Copper, Tungsten, and Oxide consumables—remained key revenue drivers, as advanced device technologies (especially increasing interconnects for advanced logic and additional 3D NAND layers) continued to ramp up production.
Looking ahead, growth will be driven by increased demand for custom-formulated slurries and innovations like ChEmpower’s CMP pads, which aim to eliminate slurries and reduce disposal costs. Additionally, investments by companies like FujiFilm and DuPont’s upcoming spin-off will further shape the market, as manufacturers focus on improving efficiency and reducing the cost of ownership in advanced semiconductor processes.
